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Title:
基板の熱処理方法および熱処理装置
Document Type and Number:
Japanese Patent JP4518463
Kind Code:
B2
Abstract:
The object of the disclosure is to measure temperature using pyrometers, in a simple and economic way, enabling precise temperature measurement, even for low temperatures. The disclosure presents an apparatus and method for thermally treating substrates, wherein the substrate is exposed to at least a first and at least a second radiation; the predetermined wavelengths of the first radiation are absorbed between the first radiation source and the substrate; a radiation from the substrate is measured in the predetermined wavelength using a radiation detector arranged on the same side as a second radiation source; the second radiation from the second radiation source is modulated and determined.

Inventors:
Marx Hauf
Christoph Strebel
Application Number:
JP2002592170A
Publication Date:
August 04, 2010
Filing Date:
May 23, 2002
Export Citation:
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Assignee:
Mattson Thermal Products GmbH
International Classes:
H01L21/26; H01L21/31; C23C16/48; C30B31/12; C30B33/02; H01L21/00; H05B3/00
Domestic Patent References:
JP8184496A
JP11237281A
JP4042025A
Foreign References:
WO2000014775A1
WO1999010718A1
WO2000034986A1
WO2000072636A1
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel



 
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