Title:
SUBSTRATE HEATING APPARATUS AND SUBSTRATE HEATING METHOD
Document Type and Number:
Japanese Patent JP2018037482
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To shorten tact time required for temperature fall of a heating part.SOLUTION: A substrate heating apparatus according to an embodiment includes: a depressurization part for depressurizing an atmosphere of a housing space of a substrate on which a solution is coated; a heating part arranged on one side of the substrate and capable of heating the substrate; an infrared heater arranged on the other side of the substrate and capable of heating the substrate with infrared rays; and a reflection surface which is arranged between the heating part and the infrared heater and reflects the infrared rays directed to the heating part.SELECTED DRAWING: Figure 1
Inventors:
KATO SHIGERU
SAHODA TSUTOMU
YAMATANI KENICHI
SHO YOSHIAKI
SAHODA TSUTOMU
YAMATANI KENICHI
SHO YOSHIAKI
Application Number:
JP2016167693A
Publication Date:
March 08, 2018
Filing Date:
August 30, 2016
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
H01L21/31; F27B17/00; F27D3/00; F27D11/02; F27D17/00; H01L21/312; H05B3/00; H05B3/10
Domestic Patent References:
| JP2006210496A | 2006-08-10 | |||
| JP2015036590A | 2015-02-23 | |||
| JP2016105487A | 2016-06-09 | |||
| JP2015141965A | 2015-08-03 |
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida
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