To provide a substrate heating device which causes less substrate contamination, eliminates the need for providing a number of chambers, and carries out heating which does not depend on the material and the surface state of the substrate.
The inside of a vacuum chamber 1 which is evacuated by evacuation systems 13, 14 is divided by a partition 32 into a first area 101 which is always kept vacuum and a second area 102 which becomes an atmospheric pressure in loading/unloading of a substrate Sb and becomes a vacuum pressure when the substrate Sb is heated. A heater 2 is arranged in its standby state in the first area 101. The substrate Sb which is carried in through a loading/unloading port 11 is stopped by a stopper 6 inside the second area 102. After a loading/unloading valve 12 is closed and the second area 102 is evacuated to vacuum, a moving mechanism 21 moves the heater 2 and brings it into contact with the substrate Sb inside the second area 102 passing through a partition valve 321 provided to the partition 32.
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