Title:
基板加熱装置及びマルチチャンバー基板処理装置
Document Type and Number:
Japanese Patent JP4540953
Kind Code:
B2
Abstract:
This application discloses a substrate heating apparatus comprising a partition separating the inside of a load-lock chamber into two areas. An inside opening provided in the partition is closed by a partition valve, while the second area in which a substrate is transferred is evacuated at a vacuum pressure by a pumping line. After the partition valve is opened, a carrier carries the substrate through the inside opening, thereby contacting the substrate onto a heat body disposed in the first area. Otherwise, after the partition valve is opened, a carrier carries a heat body through the inside opening, thereby contacting the substrate onto the heat body in the second area. This application also discloses a substrate processing system comprising a transfer chamber, and a load-lock chamber and a process chamber both provided on the periphery of the transfer chamber.
Inventors:
Masahito Ishihara
Application Number:
JP2003303992A
Publication Date:
September 08, 2010
Filing Date:
August 28, 2003
Export Citation:
Assignee:
Canon ANELVA Corporation
International Classes:
C23C16/46; F27B5/14; H01L21/02; F27B17/00; F27D11/00; H01L21/00; H01L21/31; H01L21/324; H01L21/677; H01L21/68
Domestic Patent References:
| JP11176759A | ||||
| JP10242024A | ||||
| JP7022500A |
Attorney, Agent or Firm:
Iwata Today sentence
Sayori Seto
Sayori Seto