Title:
基板加熱装置、基板処理システム及び基板加熱方法
Document Type and Number:
Japanese Patent JP6554516
Kind Code:
B2
Abstract:
to the subject of the present invention is to stably cure the coating material disposed on a substrate. To solve the problem, the substrate heating device of an embodiment includes: a chamber provided therein a receiving space capable of receiving a substrate; a pressure reducing portion capable of decompressing the atmosphere of the receiving space; a substrate heating portion disposed on at least one of one side face and the other side face of the substrate, and capable of heating the substrate; a pressure measuring portion capable of measuring the pressure of the receiving space; and a control portion capable of controlling the substrate heating portion according to the measured result of the pressure measuring portion.
Inventors:
Shigeru Kato
Hiroshi Hosoda
Hiroshi Hosoda
Application Number:
JP2017167805A
Publication Date:
July 31, 2019
Filing Date:
August 31, 2017
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
F26B25/00; F26B3/30; F26B13/10
Domestic Patent References:
| JP2017083140A | ||||
| JP2003136038A |
Foreign References:
| WO2010016421A1 |
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida