Title:
基板ホルダ、めっき装置、及びめっき方法
Document Type and Number:
Japanese Patent JP6768495
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To suppress an influence of plating solution pressure in a substrate holder.SOLUTION: A substrate holder including first and second holding members to hold a substrate comprises: an arm unit for installing the substrate holder in a plating tank, having one or a plurality of external junctions; a holding unit which holds the substrate with the first and second holding members; a plurality of contacts provided on the holding unit, for feeding electricity to the substrate; a plurality of wirings connecting the external junctions to the plurality of contacts; and a wiring accommodation unit arranged between the arm unit and the holding unit, having a housing space to accommodate different length wirings that occur due to the route difference between the external junctions and each contact.SELECTED DRAWING: Figure 23
Inventors:
Matsutaro Miyamoto
Application Number:
JP2016254106A
Publication Date:
October 14, 2020
Filing Date:
December 27, 2016
Export Citation:
Assignee:
Ebara Corporation
International Classes:
C25D17/08; C25D17/06; C25D21/00; H01L21/683
Domestic Patent References:
| JP2003277995A | ||||
| JP2016003376A | ||||
| JP2015137374A |
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yukio Kanegae
Tatsumi Ono
Makoto Watanabe
Toru Miyamae
Yukio Kanegae
Tatsumi Ono
Makoto Watanabe