Title:
めっき装置およびめっき装置とともに使用される基板ホルダ
Document Type and Number:
Japanese Patent JP6847691
Kind Code:
B2
Abstract:
The present invention provides a plating apparatus capable of individually controlling a plating process on a front surface and a back surface of a substrate and a substrate holder usable for such a plating apparatus. A substrate holder for holding a substrate which is a plating target during a plating process is provided and such a substrate holder includes a body part for holding the substrate, provided with a first opening and a second opening, the body part is configured such that when the body part holds the substrate, a plated region on the front surface of the substrate is exposed through the first opening and a plated region on the back surface of the substrate is exposed through the second opening and a sealing part that protrudes from a peripheral portion is included in at least part of the peripheral portion of the body part.
Inventors:
Toshio Yokoyama
Tomonori Hirao
Tamura Sho
Tomonori Hirao
Tamura Sho
Application Number:
JP2017021309A
Publication Date:
March 24, 2021
Filing Date:
February 08, 2017
Export Citation:
Assignee:
Ebara Corporation
International Classes:
H01L21/673; C25D17/00; C25D17/06; C25D17/08; H01L21/683
Domestic Patent References:
| JP2005097721A | ||||
| JP2002275696A | ||||
| JP10303167A | ||||
| JP2003218086A | ||||
| JP10275798A |
Foreign References:
| WO2015198955A1 |
Attorney, Agent or Firm:
Toru Miyamae
Shinjiro Ono
Yukio Kanegae
Makoto Watanabe
Shinjiro Ono
Yukio Kanegae
Makoto Watanabe