Title:
SUBSTRATE HOUSING MOLDED CASE
Document Type and Number:
Japanese Patent JP3791362
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate housing molded case that undergoes little deterioration of strength, being formed with a small number of parts for assembly thereof while maintaining a good appearance, capable of reducing the administrative cost therefor.
SOLUTION: The molded case comprises a first molded case (1) and a second molded case (2) that is a reversed form of the first molded case (1) respectively having a base bottom part (10) and a peripheral uprising part (3) arising from along the periphery thereof. The first molded case (1) accommodates a base- board (3) in such a way that it is placed on the inner surface thereof, and thereafter the first molded case (1) and the second molded case (2) are coupled by butt-mating the opening of the second molded case (2) and the opening of the first molded case (1), thus housing the base-board (3) in such a manner as to sandwich it.
Inventors:
Kei Kawaguchi
Atsushi Ueda
Atsushi Ueda
Application Number:
JP2001225807A
Publication Date:
June 28, 2006
Filing Date:
July 26, 2001
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
B65D6/02; B65D85/86; (IPC1-7): B65D6/02; B65D85/86
Domestic Patent References:
| JP2000165055A | ||||
| JP8046372A | ||||
| JP9150883A | ||||
| JP9180779A | ||||
| JP6209170A |
Attorney, Agent or Firm:
Junji Ando
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