Title:
SUBSTRATE OF IC PACKAGE
Document Type and Number:
Japanese Patent JP2001015646
Kind Code:
A
Abstract:
To prevent transfer, etc., from being interfered by restraining warp during assembly while realizing thinning.
A holding frame 3 is formed of the same material as a substrate 1 in a circumference of the substrate 1 of an IC package to enclose an IC chip mounting position 2. As for the substrate 1, glass epoxy, paper epoxy, BT (bismaleimide triazine monomer) resin, polyimide film, etc., can be used and it can be made at most 0.2 mm thick. The holding frame 3 can be used as a spacer in a resin sealing process.
Inventors:
SAWAMOTO SHUICHI
MAKI TOSHIMITSU
MAKI TOSHIMITSU
Application Number:
JP18606499A
Publication Date:
January 19, 2001
Filing Date:
June 30, 1999
Export Citation:
Assignee:
MITSUMI ELECTRIC CO LTD
International Classes:
H01L23/12; H01L21/56; H01L23/28; (IPC1-7): H01L23/28; H01L21/56; H01L23/12