Title:
SUBSTRATE INSERTION DEVICE
Document Type and Number:
Japanese Patent JP2018022578
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate insertion device capable of realizing labor saving and improvement of work efficiency by automating work for inserting a substrate of a memory module or the like into a connector.SOLUTION: A substrate insertion tool 10 configured to insert a substrate 7 held by a holding part 12 into a connector 4 including an ejector 4d comprises: insertion guide parts 13A and 13B which are provided slidable in an insertion direction of the substrate 7 with respect to the holding part 12 and include distal end portions protruding from a first end face 7d of the substrate 7 held by the holding part 12 in the insertion direction and being abutted with the connector 4 when inserting the substrate 7 into the connector 4; a coupling member 21 as an abutment part that is abutted with the ejector 4d when inserting the substrate 7 into the connector 4; and a conversion mechanism for converting changes in relative positions of the holding part 12 and the insertion guide parts 13A and 13B into a motion of the coupling member 21 changing a position of the ejector 4d from a closed position where the insertion is inhibited into an open position where the insertion is allowed.SELECTED DRAWING: Figure 12
Inventors:
YAMAMOTO MINORU
Application Number:
JP2016151645A
Publication Date:
February 08, 2018
Filing Date:
August 02, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H01R43/26
Domestic Patent References:
JPH11878A | 1999-01-06 | |||
JPS63153495U | 1988-10-07 | |||
JPS57201787U | 1982-12-22 |
Foreign References:
US20060185159A1 | 2006-08-24 | |||
US20090017666A1 | 2009-01-15 | |||
CN203434434U | 2014-02-12 |
Attorney, Agent or Firm:
Kenji Kamada
Hiroo Maeda
Hiroo Maeda
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