To improve accuracy of probing while improving inspection efficiency.

A substrate inspection apparatus comprises a probing mechanism and a control unit. The probing mechanism executes probing processing in which probing is performed on a probe 5a by moving a mounting section 14a in which the probe 5a and a camera 4a are mounted. On the basis of a result of imaging by the camera 4a, the control unit specifies a correction value for a moving amount of the mounting section 14a in the execution of probing processing. On the basis of data indicating a reference position Ps1, the control unit determines a position deviation amount between a center C of an imaging area of the camera 4a in the case where the mounting section 14a is moved so as to position the camera 4a at a counter position of the reference position Ps1, and the reference position Ps1, and executes correction value specification processing, for a plurality of reference probe positions Pp, to specify the correction value at a reference probe position Pp where the probe 5a is positioned while the camera 4a is positioned at the counter position, on the basis of distances Lx1 and Ly1 between the camera 4a and the probe 5a and the position deviation amount.