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Patent Searching and Data


Title:
SUBSTRATE INSPECTION APPARATUS AND PROBE CONTACT POSITION ADJUSTING METHOD THEREOF
Document Type and Number:
Japanese Patent JPH08114648
Kind Code:
A
Abstract:

PURPOSE: To accurately bring a probe into contact with a pad in an in-circuit test by providing a mechanism measuring the positional shift between the tooling hole of a substrate to be inspected and the pad and moving and correcting the probe contact position of upper and lower fixtures on the basis of the correction quantity corresponding to the measured value.

CONSTITUTION: A substrate support pin T provided on a lower fixture adjusting plate 23 is fitted in the tooling hole of a substrate PB to be inspected and the substrate PB to be inspected is fixed and supported on the lower fixture adjusting plate 23. Thereafter, the probe position of a lower fixture 21 is corrected with respect to the lower fixture adjusting plate 23 by operating three upper fixture adjusting parts (micrometers) 26... according to measured correction quantity and, continuously, the same correction of a probe position is performed to an upper fixture adjusting plate 22.


Inventors:
WATANABE KENICHI
Application Number:
JP24944594A
Publication Date:
May 07, 1996
Filing Date:
October 14, 1994
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
G01R31/28; H05K1/02; G01R1/06; (IPC1-7): G01R31/28; G01R1/06; H05K1/02
Attorney, Agent or Firm:
Takehiko Suzue