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Title:
SUBSTRATE INSPECTION METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP2008164416
Kind Code:
A
Abstract:

To provide a substrate inspection method and device capable of shortening the period required for insulation inspection.

When potential difference is started to be applied to an output section 13, and then a current detection section 13 detects that the current value flowing between the output section and a wiring pattern 21 decreases to a predetermined reference current value or lower, the substrate inspection device determines the insulation between a wiring pattern to which a positive electrode probe 11 is conducted and a wiring pattern to which a negative electrode probe 11 is conducted based on the detected current value by the current detection section. A plurality of reference current values are set as the reference current value for determining the timing of detecting the current value flowing between the output section and the wiring patterns for insulation determination. The plurality of reference current values are used by switch so that a larger reference current value is used as the electric capacitance between the wiring pattern to which the positive electrode probe is conducted and the wiring pattern to which the negative electrode probe is conducted increases.


Inventors:
YAMASHITA MUNEHIRO
TSUJI HIDEAKI
Application Number:
JP2006353977A
Publication Date:
July 17, 2008
Filing Date:
December 28, 2006
Export Citation:
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Assignee:
NIDEC READ CORP
International Classes:
G01R31/02; H05K3/00
Domestic Patent References:
JP2006084249A2006-03-30
JPH07301646A1995-11-14
JP2001091562A2001-04-06
JPH03154879A1991-07-02
JPS60104269A1985-06-08
JP2007333465A2007-12-27
Attorney, Agent or Firm:
Itasaka Kiyoshi