To provide a means of accurately arranging a solid immersion lens at a roughly specified fault place when a semiconductor element is inspected by an OBIRCH method or the like.

A substrate for inspection is disposed on a back of a semiconductor substrate having an electronic circuit formed on a top surface, and includes a lens acting to light propagated in the semiconductor substrate along its thickness. Defining an xy orthogonal coordinate system having, as an xy plane, a plane parallel to the top surface of the substrate for inspection, the lens converges light in a cross section perpendicular to a (y) axis and does not converge light in a cross section perpendicular to an (x) axis.