Title:
SUBSTRATE FOR INSTALLATION OF OPTICAL PARTS
Document Type and Number:
Japanese Patent JPH01221709
Kind Code:
A
Abstract:
PURPOSE:To increase the degree of selection of the solder to be used for fixing by subjecting a part or the whole of the areas where optical parts are to be fixed by soldering to metal coating. CONSTITUTION:The photosensitive glass substrate for positioning is subjected to the metal coating in at least a part or the whole of the areas thereof where the optical parts are to be fixed by soldering. For example, the metallic film is coated on all the front faces of the substrate corresponding to the areas to be installed with the respective optical parts. The metallic film consist of 3 layers in order of chromium, nickel and gold and the gold film is formed to >=2mum. Not only the solder for adhering glass but also the solder used for connecting ordinary electric circuits are usable as the kind of the solder to be used for the fixing. For example, the m.p. is freely selectcable when the solder for different m.p. is desired to be used according to the kinds of the optical parts.
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Inventors:
YOSHINAGA AKITOSHI
SUGAWARA MITSURU
SHIMIZU FUMIHIKO
TAKAMI MASAYUKI
SUGAWARA MITSURU
SHIMIZU FUMIHIKO
TAKAMI MASAYUKI
Application Number:
JP4580988A
Publication Date:
September 05, 1989
Filing Date:
March 01, 1988
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
G02B6/42; G02B7/00; H01L31/02; H01L31/0232; H05K7/20; (IPC1-7): G02B6/42; G02B7/00; H01L31/02; H05K7/20
Attorney, Agent or Firm:
Noriyuki Noriyuki (1 person outside)