Title:
SUBSTRATE FOR INSTALLING EQUIPMENT
Document Type and Number:
Japanese Patent JP2008303693
Kind Code:
A
Abstract:
To provide a substrate for installing equipment facilitating installation of the equipment without damaging a face material, and a substrate attaching structure for installing equipment.
The substrate 1 for installing equipment is used as a substrate for installing equipment on an exterior wall of a building, and comprises a plate having a round hole 1a in the center section. The plate has at least two hooking sections 1b and a gluing section 1c on which a sealing backup member is glued. The hooking sections 1b are individually formed on the same circumference of a circle, and the gluing section 1c is provided between the round hole 1a and the circumference on which the hooking sections 1b are provided.
Inventors:
KITAMURA KOJI
Application Number:
JP2007154440A
Publication Date:
December 18, 2008
Filing Date:
June 11, 2007
Export Citation:
Assignee:
DAIWA HOUSE IND
International Classes:
E04F17/04; E04F17/08
Domestic Patent References:
JP2006225850A | 2006-08-31 | |||
JPH11223015A | 1999-08-17 | |||
JPS63180790U | 1988-11-22 |
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