To provide a substrate manufacturing method which has less incidence of a level difference on a surface of a thin film.

A substrate manufacturing method comprises: landing in droplets of a thin film material on a plurality of first landing points which are distributed in a first region on a substrate and subsequently curing at least a surface layer part of the thin film material landed on the first landing points; and landing in droplets of the thin film material on a plurality of second landing points which are distributed in a second region after curing the thin film material landed on the first landing points and subsequently curing at least a surface layer part of the thin film material landed on the second landing points. The first region and the second region partially overlap each other at an overlapping region. A density of the first landing points in the overlapping region is lower than a density of the first landing points in the first region other than the overlapping region. A density of the second landing points in the overlapping region is lower than a density of the second landing points in the second region other than the overlapping region.