Title:
SUBSTRATE MANUFACTURING METHOD, AND SUBSTRATE MECHANICALLY-PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2015066642
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate manufacturing method and a substrate mechanically-processing device in which a carrier can be taken out without deformation and damage, and can be used continuously in a case that a substrate is mechanically-processed while the carrier holding the substrate is put under sun-and-planet motion.SOLUTION: A substrate manufacturing method of the present invention comprises mechanical processing in which a carrier holding the substrate is engaged with a sun gear and an internal gear, the substrate is held between an upper surface plate and a lower surface plate, and the main surface of the substrate is mechanically-processed while the carrier is put under sun-and-planet motion and taking-out processing in which, after the mechanical processing, at least one of two or more divided gear parts constituted by dividing the internal gear in the radial direction is moved horizontally to the radial direction outside of the sun gear so as to be apart from the carrier, and, thereafter, the carrier holding the substrate held between the upper surface plate and the lower surface plate is taken out from between the upper surface plate and the lower surface plate.
Inventors:
KOBAYASHI YASUKI
Application Number:
JP2013203549A
Publication Date:
April 13, 2015
Filing Date:
September 30, 2013
Export Citation:
Assignee:
HOYA CORP
International Classes:
B24B37/04; B24B37/08; G11B5/84
Attorney, Agent or Firm:
Global IP Tokyo Patent Business Corporation