Title:
SUBSTRATE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2005166946
Kind Code:
A
Abstract:
To provide a substrate at a low cost capable of withstanding a high temperature of about 400 °C required for the EM evaluation or the like, and to provide a manufacturing method thereof capable of easily manufacturing an upsized substrate.
An electric insulation layer 2 made of glass is formed to both sides of a measurement substrate 1 made of a stainless steel plate, a wiring pattern 3 is formed on the electric insulation layer 2, and an overcoat layer 4 made of glass is formed to cover the wiring pattern 3.
Inventors:
OI KENICHI
CHITEN HIRONORI
CHITEN HIRONORI
Application Number:
JP2003403582A
Publication Date:
June 23, 2005
Filing Date:
December 02, 2003
Export Citation:
Assignee:
ESPEC CORP
International Classes:
H01L21/66; G01R1/04; H01L23/14; H05K1/05; H05K3/28; H05K3/44; (IPC1-7): H05K1/05; H01L21/66; H05K3/28; H05K3/44
Attorney, Agent or Firm:
Kenzo Hara
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