PURPOSE: To obtain a substrate which can easily form contacts for electrical connection with high accuracy on semiconductor elements, electronic parts, etc., by holding conductors having projecting sections protruded in a recessed section for setting an object to be transferred formed on an insulating film in through holes formed through the internal surface of the recessed section in the thickness direction in a removable state.

CONSTITUTION: Conductors 2 having projecting sections 2a protruded in a recessed section 8 for setting an object to be transferred formed on an insulating film 1 are held in through holes 9 formed through the internal surface of the section 8 in the thickness direction in removable states. It is preferable that the film 2 has appropriate flexibility and transparency, because the conductors 2 can be easily aligned at the time of transferring the conductors 2. In addition, it is preferable to form the film 1 of a polyimide resin, because the heat resistance and mechanical strength of the film 1 can be improved. In addition, it is preferable to form the conductors 2 of solder, etc., having a low melting point so that the conductors 2 can easily melt and adhere to the section to be transferred of the object to be transferred when the conductors 2 are heated.