Title:
SUBSTRATE FOR MICROCHIP
Document Type and Number:
Japanese Patent JP3877296
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate for a microchip for preventing a sample fixing face from being deformed when an uneven force is applied from a substrate fixing jig at a measuring apparatus.
SOLUTION: In the substrate for the microchip, a means used to limit a contact face with the substrate fixing jig at the measuring apparatus is installed on the back of the sample fixing face, preferably, a height is installed in a part on the back of the sample fixing face at the means used to limit the contact face, and preferably, the height is an outer edge whose thickness is thicker than the sample fixing face. As a material for the substrate, a saturated cyclic polyolefin is preferable.
Inventors:
Hideyuki Shimaoka
Yokoyama Kanehisa
Hiroshi Sawai
Yokoyama Kanehisa
Hiroshi Sawai
Application Number:
JP2002070812A
Publication Date:
February 07, 2007
Filing Date:
March 14, 2002
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
G01N33/53; C12M1/00; C12N15/09; C40B40/02; C40B50/06; G01N37/00; (IPC1-7): G01N33/53; C12M1/00; C12N15/09; G01N37/00
Domestic Patent References:
| JP2001083158A | ||||
| JP2001231556A |
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