Title:
SUBSTRATE MOUNTING METHOD, AND METHOD OF MANUFACTURING ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2007324469
Kind Code:
A
Abstract:
To mount a shield case on a substrate in detachable manner, and actualize the mounting with reduced man-hours.
A shield member 13 which is so mounted on a substrate 10 as to cover an electronic component 11 on the substrate 10 for shielding electromagnetic waves of the electronic component, is mounted on the substrate 10 through a fixing component 12 that holds the shield member 13. Here, after the electronic component 11 and the fixing component 12 are mounted at a specified position on the substrate 10, a clip part 12b provided to the fixing component 12 is made to hold the shield member 13.
COPYRIGHT: (C)2008,JPO&INPIT
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Inventors:
TAKAHASHI MASAHIRO
Application Number:
JP2006154986A
Publication Date:
December 13, 2007
Filing Date:
June 02, 2006
Export Citation:
Assignee:
SONY ERICSSON MOBILE COMM JP
International Classes:
H05K9/00
Attorney, Agent or Firm:
Yoshitsuno Kakuda
Hitoshi Ito
Hitoshi Ito