SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

Title:

SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JPH11238829

Kind Code:

A

Abstract:

To provide a substrate for mounting a semiconductor element, and a semiconductor device in which a mounted semiconductor element can be sealed with resin without using a molding die, prevent a lead part from being deformed, and make equipment like a blanking press difficult of management unnecessary.

A wiring pattern 2 containing inner leads 3 and outer leads 6 is formed on the surface of a resin substrate 1 constituted of a synthetic resin molded object. A semiconductor element mounting part 4 is formed in a part adjacent to the inner leads 3 of the wiring pattern 2. A protruding part 5 is formed around the semiconductor element mounting part 4 and surrounds it. Liquid sealing material is injected in the protruding part 5 and cured, thereby sealing the semiconductor element mounted on the semiconductor element mounting part 4.

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Inventors:

ANDO YOSHIYUKI
SATO AKIRA
ASANO HIDEKI

Application Number:

JP4038198A

Publication Date:

August 31, 1999

Filing Date:

February 23, 1998

Export Citation:

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Assignee:

HITACHI CABLE

International Classes:

H01L23/28; H01L23/12; (IPC1-7): H01L23/12; H01L23/28

Attorney, Agent or Firm:

Tadao Hirata

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