Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
半導体発光素子実装用基板および半導体発光素子実装体
Document Type and Number:
Japanese Patent JP5868269
Kind Code:
B2
More Like This:
JP6155579A light emitting element assembly object, a projection device, and a manufacturing method of a light emitting element assembly object
WO/2023/070369MICRO LIGHT-EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREFOR
WO/2011/150597A MANUFACTURE METHOD FOR A SURFACE MOUNTED POWER LED SUPPORT AND ITS PRODUCT
Inventors:
Masahiro Sato
Application Number:
JP2012137602A
Publication Date:
February 24, 2016
Filing Date:
June 19, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Citizen Holdings Co., Ltd.
Citizen Electronics Co., Ltd.
International Classes:
H01L33/48; H01L33/50; H01L33/52; H01L33/64
Domestic Patent References:
JP3158994U
JP2011171687A
JP2006344691A
Attorney, Agent or Firm:
Akira Miyajima



 
Previous Patent: 光走査装置、及びそれを備えた画像形成装置

Next Patent: STARTING SYSTEM OF MAGNETIC DISK DEVICE