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Title:
SUBSTRATE MOUNTING TYPE ELECTROMAGNETIC RELAY AND ELECTRONIC COMPONENT ASSEMBLY
Document Type and Number:
Japanese Patent JP2012014936
Kind Code:
A
Abstract:

To prevent concentration of stress to a terminal by inertia by a measure on structure of an electromagnetic relay itself in a substrate mounting type electromagnetic relay.

An electromagnetic relay 10 includes a body 14, and a terminal 16 which extends from the body 14. The terminal 16 includes: a first part 28 which has a base part 24 projected from one side 14c of the body 14, and an intermediate part 26 which extends in the direction to cross the base part 24; a second part 32 which is extended from the first part 28, and has a connection part 30 which is conducted and connected to a circuit board 12; and a third part 44 which is extended from the first part 28 separately from the second part 32, and has a column part 46 which is brought into contact with the one side 14c of the body 14. The electromagnetic relay 10 prevents concentration of the stress to a bent part 48 between the base part 24 and the intermediate part 26 of the terminal 16 by a prop action performed by the column part 46 of the terminal 16 itself when acceleration such as vibration is generated at a state that the electromagnetic relay 10 is mounted on the circuit board 12.


Inventors:
Kurata, Yoshinori
Application Number:
JP2010000149742
Publication Date:
January 19, 2012
Filing Date:
June 30, 2010
Export Citation:
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Assignee:
FUJITSU COMPONENT LTD
International Classes:
H01H50/14; H05K1/18



 
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