Title:
SUBSTRATE POLISHING METHOD AND DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2019034379
Kind Code:
A
Abstract:
To provide a method and a device capable of efficiently polishing an entire reverse surface including the outermost part of the reverse surface of a substrate in a state that the reverse surface of the substrate faces down and to provide an efficiently processing method of the entire reverse surface including the outermost part of the reverse surface of the substrate in a state that the reverse surface of the substrate faces down.SOLUTION: In a substrate polishing method, a substrate W is rotated by rotating a plurality of rollers 11 around each shaft center while bringing the plurality of rollers 11 into contact with the peripheral edge part of the substrate W in a state that the reverse surface of the substrate W faces down, and the entire reverse surface of the substrate W is polished by relatively moving a polishing tape 31 to the substrate W while supplying a liquid to the reverse surface of the substrate W and bringing the polishing tape 31 disposed at the lower side of the substrate W into contact with the reverse surface of the substrate W.SELECTED DRAWING: Figure 1
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Inventors:
NAKANISHI MASAYUKI
ISHII YU
ITO KENYA
UCHIYAMA KEISUKE
KASHIWAGI MAKOTO
ISHII YU
ITO KENYA
UCHIYAMA KEISUKE
KASHIWAGI MAKOTO
Application Number:
JP2017157599A
Publication Date:
March 07, 2019
Filing Date:
August 17, 2017
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B21/00; B24B41/06; B24B55/02; H01L21/304
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Isamu Watanabe