基板研磨 - APPLIED MATERIALS,INCORPORATED

Title:

基板研磨

Document Type and Number:

Japanese Patent JP4346816

Kind Code:

B2

Abstract:

In one aspect, an apparatus and a method for use in substrate polishing are described wherein a conditioner head is provided for receiving an end effector for conditioning a polishing pad surface; the conditioner head is supported above the polishing pad surface to be conditioned; and the conditioner head is driven with an actuating force from a position that lies along a line that is substantially normal to the polishing pad surface to be conditioned so that an end effector attached to the conditioner head can condition the surface of the polishing pad. In another aspect, pneumatic pressure is supplied through the conditioner head support arm to apply actuating force to the conditioner head so that an end effector attached to the conditioner head can condition the surface of the polishing pad. In yet another aspect, the conditioner head support arm has a fluid channel extending therein and a fluid port, wherein the fluid channel is constructed to receive rinsing fluid and fluid port is constructed to direct rinsing fluid from the fluid channel toward the polishing pad surface to be conditioned.

Inventors:

Perlov, Ilya
Gantfalk, Eugene

Application Number:

JP2000501871A

Publication Date:

October 21, 2009

Filing Date:

July 10, 1998

Export Citation:

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