Title:
SUBSTRATE FOR POWER MODULE
Document Type and Number:
Japanese Patent JP3180621
Kind Code:
B2
Abstract:
PURPOSE: To absorb thermal deformation so as to prevent the warp or breakage of a ceramic substrate without spoiling its radiating property.
CONSTITUTION: A metallic thin plate 14 is directly joined to a ceramic substrate 13, and further a second welding material, a plastic porous metallic layer 17, a second welding material 12, and a heat sink 18 are successively stacked on the plate 14 and joined to each other respectively. The heat sink 18 has a thermal expansion coefficient different from that of the ceramic substrate 13. The substrate 13 is made of Al2O3, and the plate 14 is made of Cu, further the layer 17 is formed of porous sintered body including Cu with a porosity of 20 to 50%. In addition, the heat sink 18 is made of Cu and the second welding material 12 is made of Ag-Cu welding substance, then the layer 17 is filled with a silicone grease.
Inventors:
Toshiyuki Nagase
Koji Hoshino
Yoshio Kanda
Masafumi Hatsushika
Koji Hoshino
Yoshio Kanda
Masafumi Hatsushika
Application Number:
JP14228695A
Publication Date:
June 25, 2001
Filing Date:
June 09, 1995
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H01L23/12; H01L23/373; H05K1/05; (IPC1-7): H01L23/12
Domestic Patent References:
| JP1103853A | ||||
| JP786444A | ||||
| JP799268A | ||||
| JP60219045A |
Attorney, Agent or Firm:
Masayoshi Suda