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Title:
SUBSTRATE PROCESSING APPARATUS ANS SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2016167568
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method, which make it possible to discharge a process liquid which is temperature controlled at intended high temperature from a process liquid nozzle while achieving reduction in time required for pre-dispensing and/or achieving reduction in consumption of a process liquid for pre-dispensing.SOLUTION: A substrate processing apparatus 1 includes: a chemical nozzle 7 having a nozzle pipe 41 in which a chemical flow path 42 is zoned inside and a discharge port 46 where the chemical flow path 42 opens; a circulation route 22 which holds the chemical while keeping the temperature at a predetermined high temperature higher than ordinary temperature; and a first chemical pipe 11 for guiding the chemical held by the circulation route 22 to the chemical nozzle 7. The substrate processing apparatus further includes an induction heating unit 9 for inductively heating a pipe wall 41b of the nozzle pipe 41 which is composed to include a magnetic induction body material.SELECTED DRAWING: Figure 5

Inventors:
KOBAYASHI KENJI
Application Number:
JP2015047569A
Publication Date:
September 15, 2016
Filing Date:
March 10, 2015
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
H01L21/304; H01L21/027; H01L21/306
Domestic Patent References:
JP2000223394A2000-08-11
JP2001203138A2001-07-27
JP2000124185A2000-04-28
JPH0957176A1997-03-04
JPH1167624A1999-03-09
JPH06196469A1994-07-15
Foreign References:
US20080011322A12008-01-17
US20140231010A12014-08-21
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Goromaru Masami



 
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