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Title:
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM
Document Type and Number:
Japanese Patent JP2018081966
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce the particle level of a processed substrate by sufficiently exhibiting the filtering performance of a filter in a substrate processing apparatus that processes the substrate using processing fluid in a supercritical state.SOLUTION: The substrate processing apparatus comprises a processing container (301) and a supply line (50) that connects a fluid supply source (51) delivering processing fluid in a supercritical state and a processing container. A first on-off valve (52a) is provided in the supply line, and a first throttle (55a) that changes the processing fluid in the supercritical state, which flows through the supply line to the gas state while pressure in the processing container is critical pressure or less of the processing fluid is provided in a position downstream of the first throttle (55a), and a first filter (57) is provided in a position downstream of the first throttle (55a).SELECTED DRAWING: Figure 8

Inventors:
EGASHIRA KEISUKE
KAWABUCHI YOSUKE
GOSHI GENTARO
ONO HIROMOTO
MARUMOTO HIROSHI
MASUZUMI TAKURO
TSUKANO KENTO
KITAYAMA SHOTARO
OKAMURA SATOSHI
Application Number:
JP2016221740A
Publication Date:
May 24, 2018
Filing Date:
November 14, 2016
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/304; F26B5/00; F26B21/14
Domestic Patent References:
JP2014022520A2014-02-03
JP2008066495A2008-03-21
JP2009194092A2009-08-27
Foreign References:
US20150155158A12015-06-04
WO2012111139A12012-08-23
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Hideyuki Mori