SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Title:

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Document Type and Number:

Japanese Patent JP2013074090

Kind Code:

A

Abstract:

To suppress temperature drop of process liquid on a substrate during SPM processing.

In a substrate processing apparatus 1, liquid is discharged from a process liquid supply part 3 toward an upper surface 91 of a substrate 9 rotated by a substrate rotating mechanism 5. The process liquid supply part 3 includes a sulfuric acid supply part 31, a hydrogen peroxide solution supply part 32, a liquid mixture generation part 33 and a nozzle 34. In the substrate processing apparatus 1, heated sulfuric acid is supplied from the nozzle 34 to the substrate 9 by the sulfuric acid supply part 31, and preliminary heating processing to the substrate 9 is performed. Thereafter, the heated sulfuric acid from the sulfuric acid supply part 31 and a hydrogen peroxide solution from the hydrogen peroxide solution supply part 32 are mixed in the liquid mixture generation part 33 to generate SPM liquid, the SPM liquid is supplied to the substrate 9, and the SPM processing is performed. By performing the preliminary heating processing, the temperature drop of the SPM liquid at a high temperature supplied onto the substrate 9 is suppressed during the SPM processing. As a result, efficiency of the SPM processing is improved.

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Inventors:

FUJITA ERI
TSUJIKAWA HIROTAKA
FUJITANI YOSHINORI

Application Number:

JP2011211889A

Publication Date:

April 22, 2013

Filing Date:

September 28, 2011

Export Citation:

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