SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Japanese Patent JP2013074124

A

To provide a substrate processing apparatus which effectively removes contaminants adhered to inclined surfaces Bf, Br formed on a peripheral edge E of a substrate W by using an adhesive roller 84.

In a substrate processing apparatus, an adhesive roller 84 contacting with a peripheral edge E of a substrate W through an adhesive layer 84a is relatively moved against the substrate W along the peripheral edge E of the substrate W while rotating it (movement operation). The adhesive layer 84a is relatively moved against the substrate W in rotational axis directions Df, Db in a state that the peripheral edge E of the substrate W eats into the adhesive layer 84a during the movement operation, thereby bringing the adhesive layer 84a into contact with inclined surfaces Bf, Br. Particles adhered to the inclined surfaces Bf, Br formed on the peripheral edge E of the substrate W are captured by the adhesive layer 84a of the adhesive roller 84 and effectively removed.

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MIYA KATSUHIKO

JP2011212218A

April 22, 2013

September 28, 2011

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DAINIPPON SCREEN MFG

H01L21/304; A47L25/00; G02F1/13; G03F1/54

JP2009088244A	2009-04-23
JP2003151943A	2003-05-23
JP2007157902A	2007-06-21
JP2004319930A	2004-11-11

Kakusho Shoichi
Ryose Uji
Kazumasa Onishi

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