Title:
SUBSTRATE PROCESSING APPARATUS AND METHOD
Document Type and Number:
Japanese Patent JP2020180369
Kind Code:
A
Abstract:
To provide an apparatus and a method that avoid leakage in a processing chamber having a movable part.SOLUTION: An apparatus 200 for electrochemically processing a semiconductor substrate 208 comprises: a processing chamber 202 of a kind capable of defining a covered processing volume 218 by sealing a peripheral portion of the semiconductor substrate 208; a substrate support 206 for supporting the semiconductor substrate 208; a magnet array 232 disposed outside the processing chamber 202 and generating a magnetic field; a controller for changing the magnetic field by controlling the magnet array 232; and an agitator 220 disposed in the processing chamber 202 and provided with a magnetic reaction element 230. The magnetic reaction element 230 reacts to a change in the magnetic field of the magnet array 232 to cause repetitive motion of the agitator 220.SELECTED DRAWING: Figure 2
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Inventors:
MARTIN AYRES
MCNEIL JOHN
TREVOR THOMAS
MCNEIL JOHN
TREVOR THOMAS
Application Number:
JP2020057969A
Publication Date:
November 05, 2020
Filing Date:
March 27, 2020
Export Citation:
Assignee:
SPTS TECHNOLOGIES LTD
International Classes:
C25D21/10; C25D7/12; C25D17/06; C25D17/08
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office