Title:
基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP7108710
Kind Code:
B2
Abstract:
A substrate processing apparatus configured to process a substrate includes a substrate holder configured to hold, in a combined substrate in which a first substrate and a second substrate are bonded to each other, the second substrate; a periphery removing unit configured to remove, starting from a periphery modification layer formed on the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate, the peripheral portion from the combined substrate held by the substrate holder; and a collection unit equipped with a collection mechanism configured to collect the peripheral portion removed by the periphery removing unit.
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Inventors:
Yoshihiro Kawaguchi
Seiji Nakano
Munehisa Kodama
Hiroaki Mori
Hayato Tanoue
Yohei Yamawaki
Seiji Nakano
Munehisa Kodama
Hiroaki Mori
Hayato Tanoue
Yohei Yamawaki
Application Number:
JP2020558283A
Publication Date:
July 28, 2022
Filing Date:
November 11, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304
Domestic Patent References:
| JP2004111606A | ||||
| JP2014054694A | ||||
| JP2007319893A | ||||
| JP2016130738A | ||||
| JP2015023239A | ||||
| JP2015050402A | ||||
| JP10254146A | ||||
| JP2000114192A | ||||
| JP2014165281A | ||||
| JP2017204555A |
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine