Title:
基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP7129365
Kind Code:
B2
Abstract:
A substrate processing apparatus for performing a predetermined processing on a substrate includes a power supply device configured to supply a DC power. The power supply device includes a power supply and a current detection unit configured to detect a current value of a DC power from the power supply. The current detection unit includes a plurality of current sensors used for detecting the current value in the current detection unit and having different detection ranges for the current value, and a switching unit configured to switch the current sensors. The power supply is controlled such that the DC power from the power supply is maintained at a set value based on a detection result of the current detection unit, and the switching unit switches the current sensors depending on the set value of the DC power from the power supply.
Inventors:
Yoshinori Yamamoto
Hideomi Hosaka
Hideomi Hosaka
Application Number:
JP2019047212A
Publication Date:
September 01, 2022
Filing Date:
March 14, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C14/34
Domestic Patent References:
| JP2010116578A | ||||
| JP2003129234A |
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine