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Title:
基板処理装置および基板処理方法
Document Type and Number:
Japanese Patent JP7149111
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a suctioning unit for suctioning a processing liquid existing inside a processing liquid pipe that communicates with a discharge port, and a controller. In the suctioning step, the controller executes a suctioning step of suctioning the processing liquid existing inside the processing liquid pipe by the suctioning unit. The controller selectively executes a first suctioning step of retracting a leading end surface of the processing liquid and disposing the leading end surface of the processing liquid after suctioning in a preliminarily set standby position inside the processing liquid pipe, and a second suctioning step of retracting the leading end surface of the processing liquid further back than the standby position. After the second suctioning step, the controller further executes a standby position disposing step of supplying the processing liquid to the processing liquid pipe by the processing liquid supplying unit and disposing the leading end surface of the processing liquid in the standby position.

Inventors:
Takahiro Yamaguchi
Nozomu Iwao
Shuichi Yasuda
Kazuhiro Fujita
Noriyuki Kikumoto
Application Number:
JP2018114923A
Publication Date:
October 06, 2022
Filing Date:
June 15, 2018
Export Citation:
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Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304
Domestic Patent References:
JP2016072337A
JP2002170803A
JP2015109335A
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office