Title:
基板処理装置、及び基板処理方法
Document Type and Number:
Japanese Patent JP7267426
Kind Code:
B2
Abstract:
This substrate treatment apparatus comprises: a liquid treatment unit including a substrate holding part that horizontally holds a substrate and a liquid supply part that supplies a treatment liquid from above to the substrate which is held by the substrate holding part; a liquid preparation unit that prepares the treatment liquid used in the liquid treatment unit; and a control unit that controls the liquid supply unit and the liquid preparation unit, wherein the control unit controls the liquid supply unit to set a supply speed of the treatment liquid such that a vertical flow speed of the treatment liquid from the liquid supply unit toward the substrate is higher than a horizontal flow speed of the treatment liquid flowing along the upper surface of the substrate.
Inventors:
Rintaro Higuchi
Koji Kagawa
Takashi Inada
Koji Kagawa
Takashi Inada
Application Number:
JP2021533960A
Publication Date:
May 01, 2023
Filing Date:
July 13, 2020
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/306; H01L21/304
Domestic Patent References:
| JP2016032030A |
Foreign References:
| WO2016175233A1 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito
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