Title:
基板処理装置および基板処理方法
Document Type and Number:
Japanese Patent JP7289881
Kind Code:
B2
Abstract:
The present invention provides a conveying control form suitable for a substrate processing device and a substrate processing method, in which the substrate processing device is to configure a lifting mechanism at a processing portion for lifting a substrate from a processing position for processing the substrate. The substrate processing device of the present invention comprises: a processing portion for processing substrates; a lifting mechanism for moving a substrate after being processed at a processing position inside the processing portion toward an upper position higher than the processing position; a conveying mechanism for moving the substrate at the upper position out of the processing portion; and a control portion for controlling the conveying mechanism. The conveying mechanism may be moved among multiple positions including the move-out position for moving out the substrate from the processing portion. The control portion may determine the timing for the conveying mechanism to start moving toward the move-out position according to the time when the substrate moved by the lifting mechanism arrives at the upper position and the position of the conveying mechanism.
Inventors:
Naoaki Harada
Hiroyuki Kawamura
Hiroyuki Kawamura
Application Number:
JP2021138505A
Publication Date:
June 12, 2023
Filing Date:
August 27, 2021
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/027; H01L21/677
Domestic Patent References:
| JP2019021934A | ||||
| JP2015060966A | ||||
| JP2006294860A |
Foreign References:
| WO2014168006A1 | ||||
| WO2001054187A1 |
Attorney, Agent or Firm:
Shoichi Swing
Kazumasa Ohnishi
Kazumasa Ohnishi
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