Title:
基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
Document Type and Number:
Japanese Patent JP7212790
Kind Code:
B2
Abstract:
According to the technique of the present disclosure, there is provided a substrate processing apparatus capable of improving thickness uniformity of a film formed on each substrate. The apparatus includes a substrate retainer; a reaction tube; a vertical driver for moving the substrate retainer into or out of the reaction tube; a heater provided around the reaction tube; a gas supplier having a plurality of gas feeders corresponding to a plurality of substrates, respectively, supported by the substrate retainer; an exhauster through which a gas is exhausted from the reaction tube; and a controller capable of controlling the vertical driver and the gas supplier such that the gas is capable of being supplied through the plurality of gas feeders while maintaining a relative position of a substrate with respect to a gas feeder corresponding thereto at a first position or at a second position different from the first position.
More Like This:
Inventors:
Makoto Hirano
Yuji Takebayashi
Yuji Takebayashi
Application Number:
JP2021540668A
Publication Date:
January 25, 2023
Filing Date:
July 14, 2020
Export Citation:
Assignee:
KOKUSAI ELECTRIC Inc.
International Classes:
H01L21/31; C23C16/455; H01L21/316; H01L21/318
Domestic Patent References:
| JP5198517A | ||||
| JP2011512031A | ||||
| JP2152224A | ||||
| JP2008166321A | ||||
| JP2015177106A | ||||
| JP2007081365A |
Foreign References:
| WO2012026241A1 |
Attorney, Agent or Firm:
Polar Patent Attorney Corporation