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Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2003218497
Kind Code:
A
Abstract:

To provide a substrate processing apparatus which have a first function to prevent scratched damages or the like, a second function to prevent attaching of contaminations or the like, a third function of uniform processing for an injected processing liquid, further, these processes are realized simply, easily, surely, and automatically.

The substrate processing apparatus 1 is employed in the process of manufacturing a printed wiring board, holds the printed wiring board E with a conveyer 2 having a group of vertically grooved wheels 5, and executes each process by conveying the board without the printed circuit formed face J contacting with the wheels. Further; the group of vertically grooved wheels 5 can be adjusted in vertical distance; and right and left side injection nozzles 3 can be adjusted for injection angle in symmetrically facing arrangement, in vertical position N or slanting position, and at, deviated point from a right- angle position Q.


Inventors:
Niiyama, Kisaburo
Sugawara, Seiji
Application Number:
JP2002000017967
Publication Date:
July 31, 2003
Filing Date:
January 28, 2002
Export Citation:
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Assignee:
TOKYO KAKOKI KK
International Classes:
G03F7/30; B05C9/00; B65G35/00; C25D17/06; C25D19/00; H05K3/06; H05K3/18; H05K3/26; G03F7/30; B05C9/00; B65G35/00; C25D17/06; C25D19/00; H05K3/06; H05K3/18; H05K3/26; (IPC1-7): H05K3/06; C25D17/06; C25D19/00; G03F7/30; H05K3/18; H05K3/26