To provide a substrate processing apparatus, which can secure a spraying uniformity in a sheet width direction without increasing the number of nozzles for upsizing the substrate.

A processing liquid is supplied to the surface of a transported substrate from a plurality of spray nozzles 32 provided above a substrate transporting line and arranged in a substrate transporting direction and in a sheet width direction perpendicular thereto. As many spray nozzles 32, a pyramid nozzle spraying the processing liquid in a pyramid-shape is used. Among a plurality of nozzle rows in parallel to the sheet width direction, in the odd numbered nozzle rows, the side end portions of the spray zone between nozzles adjacent to the sheet width direction are overlapped to each other, and in the even numbered nozzle rows, the side end portions of the spray zone between nozzles adjacent to the sheet width direction are overlapped to each other to form, as a whole, the region where the spray zones are overlapped triply, intermittently in the sheet width direction. In each nozzle row, the odd numbered nozzle rows are shifted by about 1/2 pitches from the even numbered nozzle rows for the nozzle position in the substrate transporting direction not to overlap the spray zones between nozzles adjacent to the substrate transporting direction. Each spray nozzle 32 is fluctuated in the sheet width direction.