Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2017022210
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of performing independent exhaustion in first and second exhaust ports even in a process of generating a gap under a rotary table.SOLUTION: The substrate processing apparatus comprises: a rotary table 2 on which a substrate W can be mounted and which is movable vertically; a first process gas supply region P1 which is provided in a circumferential direction of the rotary table and capable of supplying a first process gas to the substrate; a second process gas supply region P2 which is provided in the circumferential direction of the rotary table separately from the first process gas supply region and capable of supplying a second process gas to the substrate; first and second exhaust ports 610 and 620 which are provided lower than the rotary table correspondingly to the first and second process gas supply regions; and conductance reduction means 90 for reducing conductance in the vicinity of the first exhaust port in a path for the second process gas to flow to the first exhaust port, via a communication space S which is generated by raising the rotary table and in which the first exhaust port and the second exhaust port are communicated.SELECTED DRAWING: Figure 8
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Inventors:
MIURA SHIGEHIRO
Application Number:
JP2015137105A
Publication Date:
January 26, 2017
Filing Date:
July 08, 2015
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/31; C23C16/455; H01L21/316; H01L21/318
Domestic Patent References:
| JP2013149728A | 2013-08-01 | |||
| JP2011135003A | 2011-07-07 | |||
| JP2008524842A | 2008-07-10 |
Foreign References:
| WO2009017322A1 | 2009-02-05 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito