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Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2018056529
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of suppressing contamination of a substrate.SOLUTION: The substrate processing apparatus according to an embodiment comprises: a support part 40 for supporting a substrate W having a surface to be processed Wa; a heating part 80 which is provided in a position to avoid the top side of the support part 40 and emits light for heating; and an optical member 90 which is provided on the opposite side of the heating part 80 with respect to the support part 40 and guides the light emitted from the heating part 80 to the surface to be proceeded Wa of the substrate W supported by the support part 40. As a result, contamination of the substrate W can be suppressed.SELECTED DRAWING: Figure 2

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Inventors:
NAGASHIMA YUJI
HAYASHI KONOSUKE
Application Number:
JP2016194722A
Publication Date:
April 05, 2018
Filing Date:
September 30, 2016
Export Citation:
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Assignee:
SHIBAURA MECHATRONICS CORP
International Classes:
H01L21/304; F26B3/30; F26B15/00
Domestic Patent References:
JP2004056070A2004-02-19
JPH02278720A1990-11-15
JP2004259734A2004-09-16
JP2016127107A2016-07-11
JP2009158564A2009-07-16
Foreign References:
US20090111274A12009-04-30
Attorney, Agent or Firm:
Misawa patent office



 
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