Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP3850226
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To successively perform different processings, such as chemical processing and rinsing processing accompanying it, by one device (one bath) and to collect and effectively reuse chemicals, etc.
SOLUTION: This processor has a substrate-holding part 12 which holds a substrate detachably, an injection head 24 which injects two kinds of liquid individually to the substrate held by the substrate holding member 12, a 1st flow passage 36 and a 2nd flow passage 38 which are provided at the periphery of the injection head 24, and a one way-flow passage closing means, which selectively closes one of the 1st flow passage 36 and 2nd flow passage 38.
Inventors:
Akihisa Hongo
Kenichi Abe
Kenichi Abe
Application Number:
JP2001103851A
Publication Date:
November 29, 2006
Filing Date:
April 02, 2001
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B08B3/02; H01L21/304; C23C18/16; H01L21/288; (IPC1-7): H01L21/304; B08B3/02; C23C18/16; H01L21/288
Domestic Patent References:
| JP2000183010A | ||||
| JP10041269A | ||||
| JP11181584A |
Attorney, Agent or Firm:
Isamu Watanabe
Shintaro Hotta
Ryoji Kosugi
Tomohiro Mori
Shintaro Hotta
Ryoji Kosugi
Tomohiro Mori
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