To provide a substrate processing device, where a substrate is heated by a lamp, where wirings laid for the lamp can be lessened in number, the substrate processing device can be lessened in manufacturing cost and enhanced in processing reliability.

Heating means 31a are connected to a power supply 32a, and four lamps 311 and a current detector 312 are provided to each of the heating means 31a. Power supply modules 32 constituted this way are provided to a substrate-processing device. With this setup, the number of wirings prepared with respect to eight lamps 311 can be set at four. When the lamp 311 is burned out, the heating means 31a where the lamp is burned out can be located by the current detector 312. As a result, wirings laid for the lamps 311 can be lessened in number, properly detecting the lamp that is burned out, so that a substrate-processing device can be lessened in manufacturing cost and improved in processing reliability.