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Title:
SUBSTRATE PROCESSING DEVICE AND METHOD FOR TRANSFERRING THE SUBSTRATE
Document Type and Number:
Japanese Patent JP3735193
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To transfer a substrate well, regardless of hydrophobic or hydrophilic property of a substrate surface by excluding liquid present on the substrate service vacuum-clamped by a vacuum-clamper hand.
SOLUTION: Nitrogen gas is blown towards an upper surface of a wafer W transported to a spin chuck 22 of a second processing part T2 by a transportation robot TR, so that before the vacuum-clamping of the wafer W by a vacuum-clamping part 43 is released, the liquid on the surface of the wafer W is blown away. Even if the upper surface of the wafer W transfer by the transfer robot TR is hydrophobic as in the case where, for example, the surface of the wafer W is processed in hydrofluoric acid at a first processing part T1, the wafer W does not drop, so no fear of defective transportation. Thus, no device stops due to defective transportation, resulting in significantly improved productivity.


Inventors:
Akihiko Taki
Application Number:
JP31552597A
Publication Date:
January 18, 2006
Filing Date:
November 17, 1997
Export Citation:
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Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
H01L21/677; H01L21/304; H01L21/68; (IPC1-7): H01L21/68; H01L21/304
Domestic Patent References:
JP4287341A
JP9102479A
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki