Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2023007512
Kind Code:
A
Abstract:
To provide a substrate processing device and a substrate processing method capable of improving substrate cleaning efficiency.SOLUTION: A substrate processing device includes a polishing unit for polishing a substrate, a cleaning unit for cleaning the polished substrate, a transport mechanism for transporting the substrate from the polishing unit to the cleaning unit, which is a transfer robot 23 having a hand 231 for holding the substrate and configured to turn over the front surface and the back surface of the substrate by rotating the hand, and an injection mechanism 26 capable of injecting the cleaning liquid onto the substrate while the substrate is being reversed by the transport mechanism.SELECTED DRAWING: Figure 4
Inventors:
ISOKAWA HIDETATSU
SHINKAI TAKESHI
YOSHINARI DAI
HASHIMOTO KOICHI
SHINKAI TAKESHI
YOSHINARI DAI
HASHIMOTO KOICHI
Application Number:
JP2019221177A
Publication Date:
January 19, 2023
Filing Date:
December 06, 2019
Export Citation:
Assignee:
EBARA CORP
International Classes:
H01L21/304; B24B55/06; H01L21/677
Attorney, Agent or Firm:
Toru Miyamae
Yukio Kanegae
Makoto Watanabe
Obata Tosho
Yukio Kanegae
Makoto Watanabe
Obata Tosho
Previous Patent: Optical member and manufacturing method thereof
Next Patent: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Next Patent: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD