Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2023089533
Kind Code:
A
Abstract:
To provide a substrate processing device that can prevent a substrate from warping and further prevent the substrate from being contaminated due to removed chips, when making a processing head press an outer periphery part of the substrate such as a wafer.SOLUTION: A substrate processing device comprises: a substrate holding part 5 having an absorbing and holding surface 5a for holding a first surface 2a of a substrate W; a processing head 7 arranged to process an outer peripheral part of the substrate W; a static-pressure plate 9 having a fluid support surface 9a opposing to the adsorbing and holding surface 5a; and a fluid supply line 10 connected to the static-pressure plate 9, and supplying fluid to a space between the fluid support surface 9a and a second surface 2b of the substrate W. The second surface 2b is a surface at the opposite side of the first surface 2a of the substrate W, and the fluid support surface 9a is larger than the adsorbing and holding surface 5a.SELECTED DRAWING: Figure 2
Inventors:
OHASHI HIROAKI
Application Number:
JP2021204086A
Publication Date:
June 28, 2023
Filing Date:
December 16, 2021
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B41/06; B24B9/00; B24B21/00; B24B55/06; H01L21/304
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa
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