Title:
SUBSTRATE PROCESSING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP3960774
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve throughput by employing what is called a batch processing system that processes a plurality of substrates simultaneously, to make the device comparatively simple, and to stably and surely carry out a process such as electroless plating.
SOLUTION: The device is equipped with a treating tank 14 that holds a processing solution 12 and that is open upward and a base board holder 16 that is freely vertically movable relative to the treating tank 14 and that has a plurality of substrate retainers 40 for holding more than one substrate W in parallel. The base board retainers 40 are provided with a ring-shaped base board stage 48 that freely moves in relatively attaching/detaching directions, that clamps the peripheral edge of the substrate W, and that holds the substrate with its back face hermetically sealed, and are also provided with a disk-like piece 54 for pressing the substrate. In addition, the substrate retainers 40 have a built-in heating-medium flow passage 62 for controlling the temperature of the retainers 40 by introducing a heating medium inside.
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Inventors:
Wang Xinming
Kenichi Abe
Koji Mishima
Kenichi Abe
Koji Mishima
Application Number:
JP2001341889A
Publication Date:
August 15, 2007
Filing Date:
November 07, 2001
Export Citation:
Assignee:
Ebara Corporation
International Classes:
C23C18/31; C23C18/16; H01L21/288; H01L21/3205; H01L21/768; H01L23/52; (IPC1-7): C23C18/31; H01L21/288; H01L21/3205
Domestic Patent References:
| JP59169370U | ||||
| JP5029300A | ||||
| JP2000252272A | ||||
| JP1216768A |
Attorney, Agent or Firm:
Isamu Watanabe
Shintaro Hotta
Ryoji Kosugi
Tomohiro Mori
Shintaro Hotta
Ryoji Kosugi
Tomohiro Mori
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