Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2016094642
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve the uniformity of the thickness of a substrate to be processed in a radial direction of a mount table from the center of rotation of the mount table.SOLUTION: A disclosed substrate processing device 10 comprises: a mount table 14 on which a substrate W is mounted and which rotates about an axis X; an antenna 22a provided in a first region R1; and a reaction gas supply unit which supplies a reaction gas to the first region R1. The reaction gas supply unit has an inner jet port 50b and an outer jet port 51b. The inner jet port 50b is provided at a position closer to the axis X than a region of the antenna 22a when viewed from the direction of the axis X, and jets the reaction gas in a direction away from the axis X. The outer jet port 51b is provided at a position farther from the axis X than a region of the antenna 22a when viewed from the direction of the axis X, and jets the reaction gas at a flow rate controlled independently of a flow rate of the reaction gas jetted from the inner jet port 50b, in the direction toward the axis X.SELECTED DRAWING: Figure 2
Inventors:
IWASAKI MASAHIDE
SORITA YUTA
SORITA YUTA
Application Number:
JP2014230977A
Publication Date:
May 26, 2016
Filing Date:
November 13, 2014
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
C23C16/455; C23C16/511; H01L21/31; H05H1/46
Domestic Patent References:
| JP2013168437A | 2013-08-29 | |||
| JP2013125762A | 2013-06-24 | |||
| JP2014520212A | 2014-08-21 | |||
| JPH04338636A | 1992-11-25 | |||
| JP2013161874A | 2013-08-19 |
Attorney, Agent or Firm:
Hiroaki Sakai
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